Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

Characteristics once primarily associated with extending smartphone battery life map directly onto the needs of real-time on-device inference.

Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...

Moving from large language models in the cloud to small language models at the edge is much more complicated than just slimming down the algorithms. It requires changes in both hardware and software, ...

A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.

Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean ...

Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...

As the semiconductor ecosystem pivots to AI, it is transforming how IP is created, verified, managed, and sold.

In this white paper, we will discuss the emerging trend in which hardware is increasingly designed to meet the end functionality of today’s systems, which is largely defined in software. This emerging ...