A research team has developed a new thin film deposition process for tin selenide-based materials. This process utilizes the metal-organic chemical vapor deposition (MOCVD) method, enabling thin film ...
In recent years, ionized physical vapor deposition (IPVD) techniques, such as high-power impulse magnetron sputtering (HiPIMS), have garnered significant attention due to their ability to enhance the ...
To mitigate these issues, a quantitative and automated monitoring strategy is required to capture the geometrical evolution of the arc and melt pool across pulse cycles, correlate these observations ...
In this interview, AZoM talks to Bas Derksema about advancements in plasma etching and deposition processes for compound semiconductor materials applications. Please could you introduce yourself and ...
Researchers from ten countries assessed the prospects of using vapor-based deposition processes to put perovskite thin film processing on the fast track to commercialization, drawing attention to its ...
In advanced coating and thin-film generation systems, deposition stages play an essential role in enhancing process efficiency and promoting greater substrate coverage. Deposition stages are capable ...
The German research institute is investigating the use of commercially available vacuum-based evaporation equipment to manufacture perovskite thin films and contacts layers in the fabrication of ...
Chemical vapor deposition (CVD) is a process widely used in the manufacturing of electronic and energy devices as it is able to form conducting, semiconducting and dielectric thin films. Here, in the ...
A new way to deposit thin layers of atoms as a coating onto a substrate material at near room temperatures has been invented at The University of Alabama in Huntsville (UAH), a part of the University ...
A technical paper titled “Quantified Uniformity and Selectivity of TiO 2 Films in 45-nm Half Pitch Patterns Using Area-Selective Deposition Supercycles” was published by researchers at IMEC, North ...
Copper’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of copper (Cu) ...
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